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Mechano- or tribochemical processes are often induced by the large pressures, of the order of 1 GPa, exerted at contacting asperities at the solid–solid interface. These tribochemical process are not very well understood because of the difficulties of probing surface-chemical reaction pathways occurring at buried interfaces. Here, strategies for following surface reaction pathways in detail are illustrated for the tribochemical decomposition of 7-octenoic and octanoic acid adsorbed on copper. The chemistry was measured in ultrahigh vacuum by sliding either a tungsten carbide ball or a silicon atomic force microscope (AFM) tip over the surface to test a previous proposal that the nature of the terminal group in the carboxylic acid, vinyl versus alkyl, could influence its binding to the counterface, and therefore the reaction rate. The carboxylic acids bind strongly to the copper substrate as carboxylates to expose the hydrocarbon terminus. The tribochemical reaction rate was found to be independent of the nature of the hydrocarbon terminus, although the pull-off and friction forces measured by the AFM were different. The tribochemical reaction is initiated in the same way as the thermal reaction, by the carboxylate group tilting to eliminate carbon dioxide and deposit alkyl species onto the surface. This reaction occurs thermally at ∼640 K, but tribochemically at room temperature, producing significant differences in the rates and selectivities of the subsequent decomposition pathways of the adsorbed products. 

The effect of the terminal groups on the nature of the films formed by the thermal decomposition of carboxylic acids on copper is studied in ultrahigh vacuum using temperature-programmed desorption (TPD), scanning tunneling microscopy (STM) and Auger electron spectroscopy (AES). The influence of the presence of vinyl or alkynyl terminal groups and chain length is studied using heptanoic, octanoic, 6-heptenoic, 7-octenoic, 6-heptynoic and 7-octynoic acids. The carboxylic acids form strongly bound carboxylates following adsorption on copper at room temperature, and thermally decompose between ∼500 and 650 K. Previous work has shown that this occurs by the carboxylate plane tilting towards the surface to eliminate carbon dioxide and deposit a hydrocarbon fragment. The fragment can react to evolve hydrogen or form oligomeric species on the surface, where the amount of carbon increases for carboxylic acids that contain terminal functional groups that can anchor to the surface. These results will be used to compare with the carbonaceous films formed by the mechanochemical decomposition of carboxylic acids on copper, which occurs at room temperature. This is expected to lead to less carbon being deposited on the surface than during thermal decomposition.